Thermal conductive materials play an important role in temperature control systems. There are two types of thermal conductive materials including thermal conductive pad and thermal conductive epoxy encapsulant.
Thermally conductive epoxy can be used in nearly any electronic product application.Epoxy encapsulant, also know as potting compound, is designed to electrically insulate and environmentally protect from moisture, chemicals, mechanical/thermal shock and vibration.From power supplies to connectors to sensors and relays, Epoxy encapsulants optimize p
We have a series of thermal conductive pads, ATCR1R5 series. This series thermal conductive pad is a special compound formed by mixing the silicon gel flour and the ceramic flour. This pad has natural weak adhesion on both sides and presents good thermal conductivity and electrical insulation under low pressure. ATCR1R5 series can work stably at -4